Join us from 28 to 30 May at Booth 3903 to explore the future of technology with #ASE at #SEMICON SEA 2024 in Kuala Lumpur #Malaysia!!!
We were incredibly excited to have the invaluable opportunity to host the Prime Minister of Malaysia, YAB Dato’ Seri Anwar Bin Ibrahim and the Minister of Investment, Trade & Industry, YB Senator Tengku Datuk Seri Utama Zafrul Tengku Abdul Aziz at #SEMICON SEA 2024 today. Mr Kwai Mun Lee, President ASE SEA & Mr HE Ooi, GM ASE Malaysia were on hand to guide the dignitaries at our booth; introducing ASE’s #advanced packaging #VIPACK technologies and investment plans in #Malaysia. Through ASE and SPIL, the ASE Technology Holding Co is investing almost 7.4 billion ringgit, for the expansion and construction of world class semiconductor packaging facilities in Malaysia. In his speech at SEMICON earlier on today, PM Anwar unveiled plans under the National Semiconductor Strategy (NSS) to attract 500 billion ringgit of investments in IC design, advanced packaging, and chip equipment. The government is also allocating funds to foster talent, train and upskill 60,000 Malaysian engineers which is excellent news for ASE’s future talent needs. It is so encouraging to hear PM Anwar emphasizing the urgency of #climate action and risk mitigation, and the need for a robust multinational semiconductor production sector to preserve mankind’s survival. The government’s proposition for Malaysia in ‘bridging technology for our shared tomorrow’ to promote technology for humanity’s greater good, resonates with ASE’s vision and sustainability goals. As ASE celebrates the company’s 40th anniversary this year, we remain focused on creating greater value for our customers through innovation and quality. More importantly, we are taking concrete steps to address climate change, pursue #netzero goals and build stronger communities for a sustainable future. Our sincere appreciation to Linda Tan Travers Lim and SEMI SEA for the outstanding support and VVIP visit arrangements.