Applied Materials’ Post

In an era of hyper-accelerated innovation, progress toward sustainability cannot be incremental. #AppliedMaterials is collaborating with our customers and business partners to transform the industry on a pathway to net zero. Together, let’s #MakePossible a more sustainable future. Learn more: https://bit.ly/3xq3LbQ

Thank you to Mark Fuselier of AMD and Applied presenters: Prabu Raja, Mukund Srinivasan, Mehul Naik, Sony Varghese, Jinho An and Sarah Wozny for leading our SEMICON West Technology Breakfast. Together they showed how advances in logic, DRAM, high-bandwidth memory and advanced packaging can deliver higher performance, more energy efficient data center AI. Presentations from the event are available here: https://bit.ly/3LhvUVP

At #SEMICONWest Applied’s Semiconductor Products Group President Dr. Prabu Raja discussed how Applied’s unique, connected portfolio is enabling key inflections in logic, DRAM, high-bandwidth memory and advanced packaging which are critical to higher performance and more energy-efficient data center AI. Learn more: https://bit.ly/4bh7wPM

It was a privilege to hear from Mark Fuselier of AMD at our SEMICON West Technology Breakfast this morning. Mark articulated AMD’s computing technology vision and shared his thoughts on how the chipmaking industry can support sustainable growth in the AI era. Mark highlighted several areas of focus – from more powerful transistors to innovations in advanced packaging and new substrate technologies – needed to deliver more energy-efficient AI computing platforms. https://bit.ly/3LhvUVP

This morning at our #SEMICONWest Technology Breakfast, Applied’s Semiconductor Products Group President Dr. Prabu Raja discussed the opportunities and challenges of the AI era – highlighting how #AppliedMaterials is co-innovating with customers to support the chipmaking roadmap. bit.ly/3LhvUVP

On the eve of SEMICON West 2024, we unveiled two new materials engineering innovations designed to extend copper interconnect wiring to the 2nm node and beyond. As chipmakers continue to shrink features with each technology generation, they must also shrink the copper wires that connect billions of transistors on a chip. While it may seem counterintuitive, smaller is not actually better when it comes to wiring. Read our press release to learn how Applied’s materials engineering breakthroughs are overcoming challenges with next-generation wiring and allowing chipmakers to scale into the “angstrom era.” https://bit.ly/46d1I89

We caught up with our field service engineers to experience a slice of life at Applied. As a most valued partner, our engineers help keep our customer fabs running by transforming problems into solutions. Join our field team today! https://bit.ly/3RlNn2E #GreatCareersHappenHere